Handbook of Silicon Based MEMS Materials and Technologies 3rd Edition Markku Tilli & Mervi Paulasto-Krockel – eBook PDF

Handbook of Silicon Based MEMS Materials and Technologies – Ebook PDF Instant Delivery – ISBN(s): 9780128177860,0128177861

Product details:

• ISBN-10 ‏ : ‎ 0323299652
• ISBN-13 ‏ : ‎ 978-0323299657
• Author: Markku Tilli, Mervi Paulasto-Kröckel, Teruaki Motooka, Veikko Lindroos

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.

The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.

Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.

• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures
• Geared towards practical applications rather than theory

Table of contents:

Part I

1. Properties of silicon; Fracture toughness

2. Czochralski Growth of Silicon Crystals

3. Properties of Silicon Crystals

4. Silicon Wafers: Preparation and Properties; Modern technologies

5. Epi Wafers: Preparation and Properties

6. Thin Films on Silicon

6.1 Thin Films on Silicon: Silicon Dioxide

6.2 Thin Films on Silicon: Silicon Nitride

6.3 Thin Films on Silicon: Poly-SiGe for MEMS-Above-CMOS Applications and Poly-Si

6.4 Thin Films on Silicon:

6.5 Thin Films on Silicon: Piezoelectric Thin Film Materials for MEMS,

6.6 Black Silicon

6.7 Thin films for Anti-stiction

7. Thick-Film SOI Wafers: Preparation and properties

Part II

8. Multiscale Modeling Methods

9. Mechanical Properties of Silicon Microstructures

10. Electrostatic and RF-Properties of MEMS Structures

11. Optical Modeling of MEMS

12. Modeling of Silicon Etching

13. Gas Damping in Vibrating MEMS Structures

14. Recent Progress in Large-scale Electronic State Calculations and Data-driven Sciences

Part III

15. MEMS Lithography

16. Deep Reactive Ion Etching; update

17. Wet Etching of Silicon

18. Porous Silicon Based MEMS

19. Surface Micromachining

20. Vapor Phase Etch Processes for Silicon MEMS

21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS

22. Microfluidics and BioMEMS in Silicon

Part IV

23. Silicon Direct Bonding

24. Anodic Bonding

25. Glass Frit Bonding

26. Metallic Alloy Seal Bonding

27. Emerging Wafer Bonding Technologies

28. Bonding of CMOS Processed Wafers

29. Wafer-Bonding Equipment

30. Encapsulation by Film Deposition

31. Dicing of MEMS Devices

32. 3D Integration of MEMS

33. Own chapter for eWLP

34. Through-Substrate Via Technologies for MEMS

35. Outgassing and Gettering

Part V

36. Silicon Wafer and Thin Film Measurements

37. Oxygen and Bulk Microdefects in Silicon

38. Optical Measurement of Static and Dynamic Displacement in MEMS

39. MEMS Residual Stress Characterization: Methodology and Perspective

40. Microscale deformation analysis

41. Strength of Bonded Interfaces

42. Hermeticity Tests

43. MEMS testing and calibration

44. MEMS Reliability

Part VI

45. Case Accelerometer

46. Case Gyroscope

47. Case Pressure Sensor

48. Case Microphone

49. Case Micromirror

50. Case Optical MEMs

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