Chapter 1: How Semiconductor Chips Are Made – Hwaiyu Geng, Lin Zhou
Chapter 2: IC Design – Ilsun Park
Chapter 3: Silicon Substrates for Semiconductor Manufacturing – K.V. Ravi
Chapter 4: Copper, Low-k Dielectrics, and Their Reliability – Hazara S. Rathore, Kaushik Chanda
Chapter 5: Fundamentals-Silicide Formation on Si – L.P. Ren, King N. Tu
Chapter 6: Plasma Process Control – David J. Coumou
Chapter 7: Vacuum Technology – Peter Biltoft
Chapter 8: Photomask – Charles Howard
PART 2: Wafer Processing
Chapter 9: Microlithography – Chris A. Mack
Chapter 10: Ion Implantation and Rapid Thermal Processing – Michael Graf
Chapter 11: Wet Etching – Peng Zhang
Chapter 12: Plasma Etching – Shouliang Lai
Chapter 13: Physical Vapor Deposition – Florian Solzbacher
Chapter 14: Chemical Vapor Deposition – Edward J. McInerney
Chapter 15: Epitaxy – Jamal Ramdani, Giovanni Vaccari
Chapter 16: ECD Fundamentals – Tom Ritzdorf, John Klocks
Chapter 17: Chemical Mechanical Planarization – Timothy S. Dyer
Chapter 18: Wet Cleaning – Andrew Machamer
Part 3: Final Manufacturing
Chapter 19: Inspection, Measurement, and Test – Donald W. Blair
Chapter 20: Grinding, Stress Relief, and Dicing – Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani
Chapter 21: Packaging – Dietrich Tonnies, Michael Topper
Part 4: Nanotechnology, MEMS, and FPD
Chapter 22: Nanotechnology and Nanomanufacturing – Zhong L. Wang
Chapter 23: Fundamentals of Microelectromechanical Systems – Michael A. Huff
Chapter 24: Flat-Panel Display Technology and Manufacturing – David N. Liu
Part 5: Gases and Chemicals
Chapter 25: Specialty Gas and CDA Systems – Wayne D. Curcie
Chapter 26: Waste Gas Abatement Systems – Joseph D. Sweeney
Chapter 27: PFC Abatement – James C. Cox
Chapter 28: Chemical and Slurry Handling Systems – Kristin Cavicchi, Dan Barsness
Chapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries – Charles K. Gould
Chapter 30: Fundamentals of Ultrapure Water – David J. Albrecht
Part 6: Fab Yield, Operations, and Facilities
Chapter 31: Yield Management – Bo Li, Wayne Carriker
Chapter 32: Automated Material Handling System – Clint Harris
Chapter 33: CD Metrology and CD-SEM – Ram Peltinov, Mina Menaker
Chapter 34: Six Sigma – Bruno Scibilia, Yoan Dupret
Chapter 35: Advanced Process Control – Robert H. McCafferty
Chapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities – Brett J. Davis, Steven R. Trammell
Chapter 37: Plan, Design, and Construction of a FAB – Industrial Design and Construction
Chapter 38: Cleanroom Design and Construction – Richard V. Pavlotsky, Stephen C. Beck
Chapter 39: Micro-Vibration and Noise Design – Michael Gandreau, Hal Amick
Chapter 40: ESD Controls in Cleanroom Environments – Larry Levit
Chapter 41: Airborne Molecular Contamination – Chris Muller
Chapter 42: Particle Monitoring in Semiconductor Manufacturing – Steven Kochevar, Jerry Gromala
Chapter 43: Wastewater Neutralization Systems – Richard E. Pinkowski
APPENDIX
INDEX