TSV 3D RF Integration: High Resistivity Si Interposer Technology – Ebook PDF Instant Delivery – ISBN(s): 9780323996020,0323996027
Product details:
- ISBN-10 : 0323996027
- ISBN-13 : 978-0323996020
- Author: Shenglin Ma , Yufeng Jin
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.
A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.
Table of contents:
Chapter 1: Introduction to HR-Si interposer technology
Chapter 2: Design, process, and electrical verification of HR-Si interposer for 3D heterogeneous RF integration
Chapter 3: Design, verification, and optimization of novel 3D RF TSV based on HR-Si interposer
Chapter 4: HR-Si TSV integrated inductor
Chapter 5: Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer
Chapter 6: HR-Si interposer embedded microchannel
Chapter 7: Patch antenna in stacked HR-Si interposers
Chapter 8: Through glass via technology
Chapter 9: Conclusion and outlook
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